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CCI11
Heat Sink, BGA, FPGAs, Double Sided Adhesive, 9.38 °C/W, BGA, 40 mm, 5 mm, 40 mm
Image is for illustrative purposes only. Please refer to product description.
No Longer Manufactured
Product Information
ManufacturerCCI
Manufacturer Part NoCCI11
Order Code1373300
Technical Datasheet
Packages CooledBGA
External Diameter - Metric-
Heat Sink MaterialAluminium
External Diameter - Imperial-
Product Range-
Product Overview
The CCI11 is a 5 x 40 x 40mm double sided adhesive BGA Heat Sink made of aluminium body. The double sided adhesive provides simple and effective attachment. This heat sink is used for a variety of applications requiring simple extension of surface area for cooling and typically used with DSP, FPGAs and other electronics packages.
Applications
Industrial
Technical Specifications
Packages Cooled
BGA
Heat Sink Material
Aluminium
Product Range
-
External Diameter - Metric
-
External Diameter - Imperial
-
Technical Docs (2)
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:Taiwan
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:Taiwan
Country in which last significant manufacturing process was carried out
Tariff No:85469010
US ECCN:EAR99
EU ECCN:NLR
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.012