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Adhesive, Thermal Conductive, 0.822 W/m.K


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Technical Docs (2)

Product Overview

Epoxy based 2 component adhesive. The main characteristics are its good heat conductivity, high dielectric strength, and an expansion coefficient suited to copper and aluminium. The thermally conductive adhesive binds porous and non-porous surfaces such as metal, glass, ceramic and almost all plastics.
  • Thermally conductive, electrically non-conductive adhesive
  • Two part epoxy resin adhesive, metaloxide filled
  • Fully replaces mechanical fastenings
  • Excellent function and application characteristics
  • Adhesive epoxy

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