Product Information
Product Overview
The 573100D00010G is a 10 x 8 x 22.86mm surface mount Heat Sink made of copper with tin plated finish. This heat sink features horizontal mount orientation and is suitable for use with D-Pak TO-252 device. This non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component. The elevated "Wings" of the heat sink provide ample surface area to dissipate the heat into the surrounding environment.
Applications
Communications & Networking, Consumer Electronics, Industrial, Motor Drive & Control
Technical Specifications
15°C/W
22.86mm
8mm
Copper
0.39"
-
No SVHC (15-Jan-2018)
TO-252
10mm
-
0.9"
0.31"
TUK SGACK902S Keystone Coupler
Technical Docs (1)
Legislation and Environmental
Country in which last significant manufacturing process was carried outCountry of Origin:China
Country in which last significant manufacturing process was carried out
RoHS
Product Compliance Certificate