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                      1. Home
                      2. Connectors
                      3. IC Sockets
                      Print Page

                      8134-HC-6P2

                      IC & Component Socket, 1 Contacts, Board to Board, HOLTITE, Beryllium Copper

                      AMP - TE CONNECTIVITY 8134-HC-6P2
                      AMP - TE CONNECTIVITY 8134-HC-6P2
                      AMP - TE CONNECTIVITY 8134-HC-6P2
                      Image is for illustrative purposes only. Please refer to product description.
                      ManufacturerAMP - TE CONNECTIVITY
                      Manufacturer Part No8134-HC-6P2
                      Order Code4168380
                      Product RangeHOLTITE
                      Technical Datasheet

                      Data Sheet

                      See all Technical Docs
                      No Longer Manufactured

                      Product Information

                      ManufacturerAMP - TE CONNECTIVITY
                      Manufacturer Part No8134-HC-6P2
                      Order Code4168380
                      Product RangeHOLTITE
                      Technical Datasheet

                      Data Sheet

                      No. of Contacts1Contacts
                      Connector TypeBoard to Board
                      Pitch Spacing-
                      Product RangeHOLTITE
                      Row Pitch-
                      Contact MaterialBeryllium Copper
                      Contact PlatingGold Plated Contacts

                      Product Overview

                      The HOLTITE series zero profile Solder less DIP Socket designed to be press-fit into the plated through-hole of a printed wiring board. This unique design allows the plated-thru hole to become the component socket. The outer conical shape of the Holtite® contact sizes the plated-thru hole when pressed into place. The precision-machined geometry allows for the controlled displacement of plated material without damaging the hole or affecting the normal mechanical and electrical contact performance. The socketing technique provides the shortest distance between the component seating plane and the contact engagement zone for maximum retention of short component leads. Open contact design permits air flow through the board, increasing heat dissipation and extending component life. Use of the Holtite® solder less system removes certain artwork restrictions necessary for wave soldering and solder joint construction.

                      • Lowest socket profile
                      • Precision-machined, tapered-entry, four finger contact
                      • Retains minimum component lead lengths
                      • Solder less, gas-tight, press-fit insertion
                      • Immediate conversion to the Holtite® system
                      • 10mΩ Maximum contact resistance

                      Applications

                      Industrial, Aerospace, Defence, Military

                      Technical Specifications

                      No. of Contacts

                      1Contacts

                      Pitch Spacing

                      -

                      Row Pitch

                      -

                      Contact Plating

                      Gold Plated Contacts

                      Connector Type

                      Board to Board

                      Product Range

                      HOLTITE

                      Contact Material

                      Beryllium Copper

                      Technical Docs (4)

                      Product Change Notice EN

                      Technical Data Sheet EN

                      Drawing EN

                      Reactivation Notices EN

                      Legislation and Environmental

                      Country of Origin:
                      Country in which last significant manufacturing process was carried outCountry of Origin:
                      Switzerland
                      Country in which last significant manufacturing process was carried out
                      Tariff No:85369090
                      US ECCN:EAR99
                      EU ECCN:NLR
                      RoHS Compliant:Yes

                      RoHS

                      RoHS Phthalates Compliant:Yes

                      RoHS

                      Download Product Compliance Certificate

                      Product Compliance Certificate

                      Weight (kg):.000454
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                      element14 is a trading name of element14 India Private Limited.
                      Company identity number: U30009KA2007PTC044448 | Registered Office: D Block, 11th Floor, IBC Knowledge Park, 4/1,Bannerghatta Main Rd, Bhavani Nagar, Suddagunte Palya, Bangalore, Karnataka 560029, India.