Print Page
RE899
IC Adapter, Fibreglass, SOIC/SOP-8, 2.54mm Pitch Spacing, 7.62mm Row Pitch
Image is for illustrative purposes only. Please refer to product description.
ManufacturerROTH ELEKTRONIK
Manufacturer Part NoRE899
Order Code2474677
Your Part Number
Technical Datasheet
No Longer Stocked
Product Information
ManufacturerROTH ELEKTRONIK
Manufacturer Part NoRE899
Order Code2474677
Technical Datasheet
Convert From8-SOIC, 8-WSOIC, 8-SOP, 8-HSOP, 8-HTSOP
Convert To-
Pitch Spacing2.54mm
Row Pitch7.62mm
Product Range-
Product Overview
- SO8, SO8w, HSOP8, HTSOP8, SOP8 multiadapter
- Epoxy fibre-glass is 1.50mm, double-sided is 35µm Cu
- Plated through holes (PTH), surface chem. Ni/Au
- Solder stop mask
- Adaption circuit board for SO8, SO8w, HSOP8, HTSOP8, SOP8
- Pitch is 1.27mm, hole spacing is 2.54mm
- Solder pads Ø 2.20mm, Pin 1 squarely
- Fits on sockets with a distance of 7.62mm
- Shield pad and cooling pad
- Size is 16.51 x 21.59mm
Technical Specifications
Convert From
8-SOIC, 8-WSOIC, 8-SOP, 8-HSOP, 8-HTSOP
Pitch Spacing
2.54mm
Product Range
-
Convert To
-
Row Pitch
7.62mm
Technical Docs (1)
Associated Products
3 Products Found
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:China
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:China
Country in which last significant manufacturing process was carried out
Tariff No:85340000
US ECCN:EAR99
EU ECCN:NLR
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.001