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SIL-PAD 900S, .009", TO-220, PK10

BERGQUIST SP900S-0.009-00-43

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Technical Documents (3)

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CAD Models - Notice
CAD Models and drawings are provided to you on a revocable limited licence for your internal use only but remain the property of the manufacturer who retain all intellectual property rights and ownership. They are provided to assist you in decision making and as design guide but are not guaranteed to be error free, accurate or up to date and is not intended to be taken as advice.
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Product Overview

The SP900S-0.009-00-43 is a 0.009 x 4 x 3-inch no adhesive Sil-Pad® high performance thermally conductive Insulation Material which is designed for a wide variety of applications requiring high thermal performance and electrical isolation. These applications also typically have low mounting pressures for component clamping. Sil-Pad 900S material combines a smooth and highly compliant surface characteristic with high thermal conductivity. These features optimize the thermal resistance properties at low pressures. Applications requiring low component clamping forces include discrete semiconductors (TO-220,TO-247 and TO-218) mounted with spring clips. Spring clips assist with quick assembly and apply a limited amount of force to the semiconductor. The smooth surface texture of Sil-Pad 900S minimizes interfacial thermal resistance and maximizes thermal performance.
  • UL94V-0 Flammability rating
  • Electrically isolating
  • Low mounting pressures
  • Smooth and highly compliant surface
  • General-purpose thermal interface material solution
  • -60 to 180°C Temperature range


Safety, Industrial, Automotive

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