50-02-1030-0000-55E

50-02-1030-0000-55E is a CHO-BOND® 1030 one component flexible electrically conductive silicone adhesive. It is a silver plated copper filled, one-component conductive silicone designed for applications where a flexible, strong, conductive electrical bond must be achieved. CHO-BOND 1030 greatly simplifies the problem of bonding conductive silicone EMI gaskets to metal substrates. It is formulated for relatively small bond lines, less than 0.010inches (0.25mm), and should not be used as an EMI caulk where bond lines are greater than 0.010inches (0.25mm). No volatile organic compounds (VOCs) and minimal shrinkage upon curing make CHO-BOND 1030 a good choice for a variety of commercial and military applications. Typical applications include sealing of EMI vents and windows, bonding, repair, and attachment of EMI gaskets.

• One component system so no mixing or measuring required
• Silver-plated copper filler is a low cost solution to electrical bonding
• Good conductivity levels (0.050 ohm-cm)
• Moderate adhesion properties (>200PSI lap shear strength)
• Medium paste consistency means it can be used on overhead or vertical surfaces
• No volatile organic compounds and no corrosive by-products generated when curing
• 1086 primer included, silicone polymer, silver-plated copper filler, light grey colour
• 1.5 fluid ounce aluminium foil tube package, 113.4g weight
• 1379kPa lap shear strength, 3.8 specific gravity, 0.5h operating time
• Operating temperature range from -55 to 200°C