65-02-GEL30-0030

65-02-GEL30-0030 is a THERM-A-GAP™ GEL 30 high-performance, fully cured, dispensable gel. It is a fully cured dispensable gel designed to eliminate time-consuming hand assembly, decreasing installation costs and reducing customer manufacturing and purchasing (logistical) complexity. It requires no mixing or curing, providing superior design flexibility. It deflects easily under very low compressive forces, decreasing stress on components, thus decreasing component failures. Typical applications include automotive electronic control units (ECUs), power supplies and semiconductors, memory and power modules, microprocessors and graphics processors and flat panel displays and consumer electronics.

• Easily dispensable, fully-cured/no pump out, high bulk thermal conductivity
• Provides low thermal impedance at thin and thick gaps, allowing use of common heat spreaders
• Compatible with high volume, automated dispense processes, meets Telcordia (Bellcore) silicone specs
• 3.5W/m-K thermal conductivity, 1J/g-K heat capacity, 150ppm/K coefficient of thermal expansion
• Low thermal impedance, ultra low compression force, high tack surface and reworkable
• Proven reliability in extreme temperature cycling and shock and vibration
• Successfully used to fill a variety of different gap thickness, 10^14ohm-cm volume resistivity
• 20grams/min flow rate, 3.1 specific gravity, 2 deflection at pressure, 0.1mm film thickness
• 18 months shelf life
• Operating temperature range from -55 to 200°C