400001
Sample Kit, Thermal Interface Solution Envelop, Vertical
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| Quantity | Price |
|---|---|
| 1+ | Rs.10,999.940 |
| 5+ | Rs.10,779.950 |
| 10+ | Rs.10,559.950 |
Product Information
Product Overview
Thermal interface solutions sample kit includes WE-TGF thermal gap filler pad (reinforced shape: square; 100 x 100 x 1mm, thermal conductivity = 1 W/(m⋅K)), WE-PCM phase change material (shape: square; 100 x 100 x 0.2mm, thermal conductivity = 1.6W/(m⋅K)), WE-TTT thermal transfer tape (shape: square; 100mm x 100mm x 0.2mm, thermal conductivity: <gt/>=1W/(m⋅K), dielectric strength: 4KV/mm, adhesive strength: <gt/>= 5.79N/cm), WE-TINS thermally conductive insulator pad (shape: square; 65 x 65 x 0.23mm, thermal conductivity = 1.6W/(m⋅K)).
- Vertical thermal interfaces envelop
- Fill a gap to provide a path for the heat energy to flow
Contents
WE-TGF thermal gap filler pad, WE-PCM phase change material, WE-TTT thermal transfer tape, WE-TINS thermally conductive insulator pad.
Technical Specifications
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WE-TGF Filler Pad, WE-TINS Insulator Pad, WE-PCM Thermal Phase Changing Material, WE-TTT Tape
No SVHC (21-Jan-2025)
Technical Docs (1)
Legislation and Environmental
Country in which last significant manufacturing process was carried outCountry of Origin:China
Country in which last significant manufacturing process was carried out
RoHS
RoHS
Product Compliance Certificate